Method for manufacturing a die assembly having a s

专利名称：Method for manufacturing a die assembly

having a small thickness and die assemblyrelating thereto

发明人：Giorgio Allegato,Marco Ferrera,Matteo

Garavaglia,Lorenzo Corso

申请号：US14524661申请日：20141027公开号：US09327964B2公开日：20160503

专利附图：

摘要：A method for manufacturing a die assembly, including the steps of: bonding a

first wafer of semiconductor material to a second wafer, the second wafer including arespective semiconductor body having a respective initial thickness and forming anintegrated electronic circuit; and subsequently reducing the initial thickness of thesemiconductor body of the second wafer; and subsequently bonding the second wafer toa third wafer, the third wafer forming a micro-electromechanical sensing structure.

申请人：STMicroelectronics S.r.l.

地址：Agrate Brianza IT

国籍：IT

代理机构：Seed IP Law Group PLLC

更多信息请下载全文后查看