专利名称：CHEMICAL MECHANICAL POLISHING
AQUEOUS DISPERSION PREPARATION SET,METHOD OF PREPARING CHEMICALMECHANICAL POLISHING AQUEOUSDISPERSION, CHEMICAL MECHANICALPOLISHING AQUEOUS DISPERSION, ANDCHEMICAL MECHANICAL POLISHINGMETHOD
发明人：Eiichirou KUNITANI,Hirotaka SHIDA,Kazuhito
UCHIKURA
申请号：US12127334申请日：20080527
公开号：US20080318427A1公开日：20081225
专利附图：
摘要：A chemical mechanical polishing aqueous dispersion preparation set including: afirst composition which includes colloidal silica having an average primary particlediameter of 15 to 40 nm and a basic compound and has a pH of 8.0 to 11.0; and a secondcomposition which includes poly(meth)acrylic acid and an organic acid having two or morecarbonyl groups other than the poly(meth)acrylic acid and has a pH of 1.0 to 5.0.
申请人：Eiichirou KUNITANI,Hirotaka SHIDA,Kazuhito UCHIKURA
地址：Yokkaichi-shi JP,Yokkaichi-shi JP,Yokkaichi-shi JP
国籍：JP,JP,JP
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