G5214 is an integrated charger/boost convertor with power path control for 1 cell Li-lon battery bank. The power path controller detects adapter input and control internal power switch of power path with over-voltage and over-current protection.
The system operates in charger mode when adapter plug in. Charge current, battery voltage and adapter input current limit are regulated by constant off time buck controller with internal power MOSFET. The sys-tem enters trickle charge if battery voltage is too low. The charging stops if defective battery is detected. Charge Voltage has 2 options, 4.35V and 4.2V. Charge Current has 2 options, 2A and 1.5A. FLAG output indicates the charger status.
The system operates in boost mode if adapter is absent and battery voltage is high enough. The output voltage is adjustable by external resistors with over current and short circuit protection. A 3-levels logic control the on/off and over-current of boost convertor.
Integrated Charger/Boost Convertor with Power Path Control
Features
Adaptor Input Detection and Power Path Control Built-in 90mΩ Power Switch for Power Path Control
Adapter Input Over-Voltage Protection
High Accuracy Switching Charger for 1 Cell Li-lon battery with Internal Compensation
±0.5% Accuracy Battery Charger Output Voltage Charger Status Flag Output
Adapter Input Current Limit Controller with Built-in Current Sense Resistor
Trickle Charging and Defective Battery Detec-tion
High Efficiency Synchronous Boost Convertor Adjustable Output of Boost Convertor
Enable and Current Limit Control Pin for Boost Convertor.
Output Short Circuit Protection for Boost Con-vertor
Available for 4.2V/4.3V/4.35V Charge Voltage Setting
Available for 2A/1.5A Charge Current SOP-8 (FD) Package
Applications
Mobile Battery Bank
Ordering Information
ORDER NUMBER
MARKING
CHARGE Current
2A 2A 1.5A 1.5A CHARGE Voltage TEMP. RANGE PACKAGE (Green)
G5214AF11U G5214A G5214CF11U G5214C G5214DF11U G5214D G5214FF11U G5214F Note: F1:SOP-8 (FD) 1: Bonding Code
U: Tape & Reel
4.35V -40°C to +85°C SOP-8 (FD) 4.2V -40°C to +85°C SOP-8 (FD) 4.35V -40°C to +85°C SOP-8 (FD) 4.2V -40°C to +85°C SOP-8 (FD) Pin Configuration
G5214EN/OCLXVSYSVADP12349 GNDThermalPad8765CSIPVBATBTFBFLAGSOP-8 (FD)Note: Connect the thermal PAD to GND for proper function and excellent power dissipation Ver: 0.91 Aug 15, 2014
TEL: 886-3-5788833http://www.gmt.com.tw
1
Global Mixed-mode TechnologyG5214 Storage Temperature . . . . . . . . . . . . -65°C to +150°C Junction Temperature . . . . . . . . . . . . -10°C to +150°C Reflow Temperature (soldering, 10sec) . . . . . . .260°C ESD Protection (Human Body Mode) . . . . . . . . . . .2kV
Absolute Maximum Ratings
Supply Voltage (ADP to GND) . . . . . . . . .-0.3V to 6.5V Supply Voltage (ADP to GND, <30µS pulse)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 9V Supply Voltage (VSYS, VBAT to GND) . . . -0.3V to 6V CSIP to GND . . . . . . . . . . . . . . . . . . . . -0.3V to 6V LX to GND . . . . . . . . . . . . . . . . . . -0.5V to VSYS+0.5V Other Pins to GND. . . . . . . . . . . . . . . . . . . .-0.3V to 6V Thermal Resistance Junction to Ambient, (θJA)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .132°C/W(1) SOP-8 (FD) (1in2). . . . . . . . . . . . . . . . . . . . 108°C/W(2) Continuous Power Dissipation (TA = +25°C)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .0.9W(1) SOP-8 (FD) (1in2). . . . . . . . . . . . . . . . . . . . . . .1.2W(2) Thermal Resistance Junction to Case, (θJC)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 12°C/W
Stress beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
Recommended Operation Conditions
Supply Voltage (ADP to GND) . . . . . . . 4.8V to 5.5V Supply Voltage (VBAT to GND) . . . . . . .3V to 4.2V Operation Temperature (TA) . . . . . . . -40°C to +85°C
Note: (1)
: Please refer to Minimum Footprint PCB Layout Section. (2)
: Please refer to 1in2 of 1oz PCB Layout Section.
Electrical Characteristics
ADP =5V, VBAT=3.7V, TA =25°C, unless otherwise noted.
The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.
PARAMETER CONDITION MIN TYP MAXUNITS
Battery Leakage Current
VBAT UVLO/ Trickle Charge Threshold
VBAT=2.5V, Boost Convertor Stops VBAT=3.7V, Pull EN/OC low to shutdown
VBAT Rising
--- --- 2.6
20 35 2.75
30 45 2.9
µA
Battery Quiescent Current =IVSYS0 --- 500 700 µA
On-Resistance of Switches VSYS Short Circuit Blanking Time VSYS Short Circuit Auto-Restart Time EN/OC Threshold FLAG On Resistance FLAG Pin Leakage
Thermal Shutdown Threshold Thermal Shutdown Hysteresis Adapter Power Path Control Adapter Power Good Threshold Adapter OVP Threshold Current Limit of Power Switch
V
VBAT Falling 2.5 2.65 2.8
mΩ Switch from VADP to VSYS --- 90 100
mΩ Switch from VSYS to LX, V=44 52 SYS5V --- mΩ =39 45 Switch from LX to GND, VSYS5V ---
26
34
43
ms
177 238 300 ms
EN/OC input high threshold 4.5 --- --- V EN/OC input low threshold --- --- 0.3 EN/OC floating logic threshold ADP=5V
FLAG=6V
Temperature Rising
ADP rising ADP falling ADP rising
ADP falling G5214A/B/C, VSYS=0V G5214D/E/F, VSYS=0V
1.1 ---
--- --- ---
--- 18 0.1 150 25
3 40 0.5 --- ---
Ω µA °C °C
4.65 4.74 4.83 V 4.47 4.56 4.64 V 5.85 6.02 6.2 V 5.65 5.78 5.93 V 2.3 2.6 3.1 A
1.8 2.1 2.6
Ver: 0.91 Aug 15, 2014
TEL: 886-3-5788833http://www.gmt.com.tw
2
Global Mixed-mode TechnologyG5214 Electrical Characteristics (continued)
PARAMETER CONDITION MIN TYP MAXUNITS
BOOST CONVERTOR
BTFB Output Voltage VSYS Short Current Limit
Reduction VSYS Short Current Limit
VBAT=3.0V~4.2V, IVSYS=0~2A 0.59 0.61 0.63V
2.1 2.5 2.7 A VBAT>VSYS, RSNS=10mΩ, EN/OC floating
1.83A VBAT>VSYS, RSNS=10mΩ, EN/OC input high1.4 1.69 5.35 6.05 6.44VBAT=3.7V, EN/OC floating, RSNS=10mΩ
Normal Inductor Peak Current Limit A 3.91 4.60 5.42VBAT=4.2V, EN/OC floating, RSNS=10mΩ
5.42 6.40 7.49VBAT=3.0V, EN/OC floating, RSNS=10mΩ
VBAT=3.7V, EN/OC input high, RSNS=10mΩ4.30 4.80 5.10Reduction Inductor Peak Current Limit A VBAT=4.2V, EN/OC input high, RSNS=10mΩ3.35 3.75 4.25VBAT=3.0V, EN/OC input high, RSNS=10mΩ4.36 5.10 6.00=VBAT3.7V 1.247 1.434 1.649
Off-Time µs =VBAT4.2V 1.42 1.632 1.877
=VBAT3V 1.021 1.164 1.339
Minimum Off-Time --- 250 --- ns
VSYS rising, reference to the normal boost
Boost Convertor OVP Threshold 5 8 11 % output
Current Threshold of Asynchronous Converting RSNS=10mΩ 100 150 300mA Soft Start Time VBAT=3.7V, VSYS Rising to 4.8V --- 1 --- ms Battery Charger
G5214C/F 4.179 4.2 4.221
Battery Charge Voltage Accuracy V
G5214A/D 4.328 4.35 4.3721.83 2 2.17G5214A/C, RSNS=10mΩ
Charge Current Accuracy A
1.37 1.5 1.63G5214D/F, RSNS=10mΩ
110 250 350G5214A/C, RSNS=10mΩ
Trickle Charge Current Accuracy mA
80 200 300G5214D/F, RSNS=10mΩ
G5214A/C 1.8 2 2.3 Adapter Current Limit Accuracy A
G5214D/F 1.3 1.5 1.8 VSYS=5V, VBAT=3.7V 0.543 0.621 0.714
Off-Time µs VSYS=5V, VBAT=4.2V 0.329 0.379 0.436
VSYS=5V, VBAT=2V 1.243 1.429 1.643
Minimum Off-Time --- 250 --- ns Dead Battery Detection Timeout Period 15415 17728 20387S
VBAT rising, reference to the charge voltage3.88 4 4.12
Battery OVP Threshold %
VBAT falling, reference to the charge voltage2.43 2.5 2.58
Current Threshold of Asynchronous Converting RSNS=10mΩ -100 146 270mA
Minimum Footprint PCB Layout Section
SOP-8 (FD)Ver: 0.91 Aug 15, 2014
TEL: 886-3-5788833http://www.gmt.com.tw
3
Global Mixed-mode Technology1in2 of 1oz PCB Layout Section
SOP-8 (FD)
G5214
Ver: 0.91 Aug 15, 2014
TEL: 886-3-5788833http://www.gmt.com.tw
4
Global Mixed-mode TechnologyG5214 PIN FUNCTION
Pin Descriptions PIN NAME Leave the pin floating set normal operating of boost convertor. Connect this pin to VBAT set
1 EN/OC the current limit of boost convertor to 3/4 of normal value. Connect this pin to GND to shut
down the boost convertor.
2 LX Connect the pin to output inductor. 3 4
VSYS VADP
System output. Connect 33µFX2 capacitors to GND. AC adapter input. Connect a capacitor to GND.
Charger status indicator, open-drain output. The output is pulled low if the system is in charg-5 FLAG ing mode and battery is not fully charged. 6 7 8
BTFB VBAT CSIP
Connect 2 resistors in series from VSYS to BTFB to GND to set the boost output votage Battery input. Connect 20µF capacitors to GND. Current detection input.
9 GND Ground
Block Diagram
AdapterInput VADP 10µF
VBAT
100kΩ
FLAG
VBAT BCSIP A VSYS
91kΩ BTFB
200kΩ13kΩ
Ver: 0.91 Aug 15, 2014
Current SensorVSYSSystemOutputCOUT33µF×2CurrentSensorAdapterOVP/UVPGateControlSwitchOver-CurrentProtectionChargePumpCharger StatusBatteryVoltage Referencex1.04XCharger Adapter Current SettingCurrent LimitBattery OVPCompensationNetworkBoost / Charger ModulatorBoost / ChargerMode SelectionALX3.3µHXBoostCurrent LimitRSNS10mΩBEN/OCSettingVREFCOUT10µF×2GNDBatteryEN/OCTristate Logic Input
TEL: 886-3-5788833http://www.gmt.com.tw
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Global Mixed-mode TechnologyG5214 output current limit changes slightly versus battery voltage.
EN/OC pin controls the operation of boost convertor. The current limit is set to 3/4 of normal value when EN/OC is connected to VBAT. The boost convertor is shut down if EN/OC pin is pulled to GND. Leave the pin floating for normal operation.
Charger Convertor
In charger mode, adapter is connected to VSYS as the power of charger for 1 cell Li-lon battery. The system controls the battery voltage to 4.35V, 4.3V or 4.2V for G5214A/G5214D and G5214CG5214F, respectively. The charging current is lower down if adapter current is larger than a preset level. The current limit of total adapter current is 2A or 1.5A and current is sensed by internal resistor. The controller is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 700kHz. The charger convertor is internal compensated.
If battery voltage is below the UVLO threshold, the system is trickle charged with 15% of the normal charging current. The battery is determined as dead battery if battery voltage keeps under the UVLO threshold for over 17728S.
G5214 has over-voltage protection for charger. The high and low side switched are turned off immediately if battery voltage goes over 4% of normal battery volt-age setting.
The charge current is 2A or 1.5A. The adapter current is also limited to 2A or 1.5A. The current limits of power switch is 2.6A or 2.1A.
Over-Current Protections
The over-current protection of VSYS pin is auto-restart mode. If any of VSYS OCP event occurs (OCP of power switch or boost convertor) and lasting over 34ms, the system shutdown for 238ms and re-start again. The function keep the system temperature low even if VSYS is short. G5214 also have over-temperature protection. The whole system is shutdown if temperature rises over 150°C.
Charger Status Flag
When G5214 operates in charging mode, FLAG out-puts low if the battery is not fully charged. The FLAG pin outputs high impedance if system is not in charg-
Function Description
G5214 detects the plug-in of adapter, turns on power switch and decides boost/charging mode of the sys-tem automatically. If adapter is absent and battery voltage is high enough, the power switch is turned off and G5214 is in boost mode, the boost converter out-puts to system output source from battery. The power switch is turned on after adapter is plugged-in and detected. G5214 turns into charger mode after the power switch is fully turned on. In charger mode, sys-tem output is directly supply from adapter via the power switch, and the charger convertor supply charging current to the battery from system output. There are several protections of power path, boost convertor and charger convertor.
Power Path Control
Adapter is detected if VADP is larger than power good threshold (4.74V with hysteresis) and smaller than OVP threshold (5.78V with hysteresis). After the de-tection of adapter, the power switch between VSYS and VADP turns on. The gate of NMOS switch rises slowly to minimize surge current of adapter. There is over-current protection for the power switch. If over-load occurs on VSYS, the switch gate is lowered down to keep the current flow through the switch in current limit to protect adapter and the switch.
When adapter input OVP is detected, the power switch is shutdown immediately to keep VSYS below normal voltage range to protect the devices connected to VSYS from damaged by high voltage.
After the gate of power switch rises high enough and no abnormal event is detected. The system gets into charger mode. If system isn’t in charger mode and the battery voltage is higher than VBAT UVLO threshold, the system operates in boost mode, otherwise the system is shutdown.
Boost Convertor
In boost mode, VSYS is boosted to the voltage setting by external resistors connected from VSYS to BTFB to GND. The BTFB pin is regulated to 0.61V. The con-troller of boost is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 500kHz. Internal soft-start controls the rising time of VSYS output to about 1ms. There is OVP function of boost output.
Boost convertor has current limit functions. If VSYS is lower than VBAT, the inductor current is limited to 2.5A. If VSYS is larger than VBAT, G5214 performs cycle by cycle peak inductor current limit. The current limit value is inversely proportion to VBAT, that makes
Ver: 0.91 Aug 15, 2014
ing or the battery is fully charged.
TEL: 886-3-5788833http://www.gmt.com.tw
6
Global Mixed-mode TechnologyG5214 tie-point between the signal ground and the power ground is at the negative side of the output capacitor on each side, where there is little noise; a noisy trace beneath the IC is not recommended.
LX Pin
This trace should be short, and positioned away from other weak signal traces. This node is noisy and has high voltage swing. No trace should be in parallel with it.
CSIP, VBAT Pins
These pins is used as the battery voltage and inductor current feedback. The traces should be away from the noisy pins like LX. In general, the current sense resis-tor RSNS should be close to the IC.
Copper Size for the LX Node
The capacitance of LX should be kept very low to minimize ringing. It would be best to limit the size of the LX node copper.
Exposed PAD
It’s highly recommended to add larger copper to ex-posed PAD connected to signal ground. At high cur-rent operation, the power consumption is high. Large copper to exposed PAD decrease thermal resistance much.
Application Information
Inductor Selection
Inductance between 3.3µH and 10µH is recommended. The RHZ is lower with large inductance. Select smaller inductance with larger VSYS capacitance to enlarge system bandwidth with the same output ripples at boost mode. It’s important to select inductor with maximum current to avoid saturation. Check both charger mode and boost mode for peak current.
VSYS Capacitor Selection
The recommended value of this capacitors is 33µFX2. This value maintain the boost controller loop at proper bandwidth with sufficient phase margin.
VBAT Capacitor Selection
Connect 20µF capacitor to maintain charger loop sta-bility and serve as input capacitor at boost mode.
Current Sense Resistor Selection
The charging current and current limit at boost mode are inverse proportion to RSNS. Select 10mΩ RSNS for proper current setting. To maintain stability of charger loop, 10mΩ or larger RSNS is recommanded.
PCB Layout Considerations
Signal Ground and Power Ground Connection
At minimum, a reasonably large area of copper, which will shield other noise couplings through the IC, should be used as signal ground beneath the IC. The best
Ver: 0.91 Aug 15, 2014
TEL: 886-3-5788833http://www.gmt.com.tw
7
Global Mixed-mode TechnologyG5214 Package Information
SOP- 8 (FD) Package
Taping Specification
PACKAGE Q’TY/REEL
SOP-8 (FD)
2,500 ea
Ver: 0.91 Aug 15, 2014
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833http://www.gmt.com.tw
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