专利名称：MICRO ELECTRO MECHANICAL SYSTEM
STRUCTURES
发明人：Ting-Ying CHIEN,Yi Hsun CHIU,Ching-Hou
SU,Chyi-Tsong NI
申请号：US13353765申请日：20120119
公开号：US20130187245A1公开日：20130725
专利附图：
摘要：A micro electro mechanical system (MEMS) structure includes a first substratestructure including a bonding pad structure. The bonding pad structure has at least one
recess therein. A second substrate structure is bonded with the bonding pad structure ofthe first substrate structure.
申请人：Ting-Ying CHIEN,Yi Hsun CHIU,Ching-Hou SU,Chyi-Tsong NI
地址：Hsinchu City TW,Zhubei City TW,Hsinchu City TW,Hsinchu TW
国籍：TW,TW,TW,TW
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