专利名称：IC CARD AND MANUFACTURING METHOD
THEREOF
发明人：Takahiro Sakurai,Yuichi Ito申请号：US12447731申请日：20071107
公开号：US20100059899A1公开日：20100311
专利附图：
摘要：This IC card is provided with a module having an inlet, an adhesive layer coveringthe module, and a first base material and second base material sandwiching the modulewith interposition of the adhesive layer. The module is disposed on one face of the firstbase material with interposition of a viscous layer which has a thickness that variesaccording to the thickness at each area of the module, and its two ends are narrowerthan its other parts when viewed from the outer face side of the first base material or theouter face side of the second base material. According to this IC card, it is possible tooffer the IC card with a flat surface, and without occurrence of strain in the embedded ICchip.
申请人：Takahiro Sakurai,Yuichi Ito
地址：Tokyo JP,Tokyo JP
国籍：JP,JP
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