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UC3804X

2022-12-08 来源:汇智旅游网
www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeFeaturesPackageφ3 Round shape type, UB,UC,UG: Water Clear epoxy UY: Pale Yellow Clear epoxy UR: Pale Red Clear epoxy ・Outer Dimension φ3 Round shape type・Operation temperature range.Storage Temperature:-40℃~100℃Operating Temperature:-40℃~85℃・Lead–free soldering compatible・RoHScompliantProduct featuresDominant wavelengthBlueBlue GreenGreenYellowRed: 470nm (UB): 505nm (UC): 525nm (UG): 590nm (UY): 626nm (UR) Half Intensity AngleUB,UC,UGUY,UR: 56 deg.: 66 deg.Die materialsRank grouping parameterSoldering methodsESDPackingUB,UC,UG : InGaN, UY,UR : AlGaInPSorted by luminous intensity per rank tapingTTW (Through The Wave) soldering and manual solderingInGaN: Less than 1kV(HBM),Bulk : 200pcs(MIN.)AlGaInP: More than 2kV(HBM)Recommended ApplicationsAmusement Equipment,Electric Household Appliances, OA/FA, Other General Applications2006.7.31Page 1

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www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeColor and Luminous IntensityDominantWavelength λd (nm)TYP.IFMIN.(Ta=25℃)Part No.MaterialEmittedColorLensColorLuminous IntensityIv (mcd)TYP.IFUB3804XUC3804XUG3804XUY3864XUR3864XInGaNInGaNInGaNAlGaInPAlGaInPBlueBlue GreenGreenYellowRedPaleYellowPaleRedWaterClearClear47050552559063020202020202406729602502206722,6882,68850044020202020202004.10.29Page 2www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeAbsolute Maximum RatingsItemPower DissipationForward CurrentPulse ForwardCurrent ※1Derating(Ta=25℃ or higher)Reverse VoltageOperatingTemperatureStorageTemperatureSymbolPdIFIFRM⊿IFVRToprTstgAbsolute Maximum RatingsUB10525600.335UC10525600.335UG10525600.335-40~+85-40~+100UY150501000.675UR150501000.675UnitmWmAmAmA/℃V℃℃(Ta=25℃)※1 IFRM Measurement condition : Pulse Width≦1ms., Duty≦1/20.2004.10.29Page 3www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeElectro-Optical CharacteristicsCharacteristicsUBTYP.Forward VoltageIF=20mAVFMAX.Reverse CurrentPeak WavelengthDominantWavelengthSpectral Line HalfWidthHalf Intensity AngleVR=5VIF=20mAIF=20mAIF=20mAIF=20mAIRλpλd⊿λ2θ1/2MAX.TYP.TYP.TYP.TYP.4.210046547026564.210050250530564.210051752535562.810059259018662.81006416301866μAnmnmnmdeg.3.7UC3.7UG3.7UY2.2UR2.2V(Ta=25℃)ItemConditionsSymbolUnit2004.10.29Page 4www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeLuminous Intensity RankRankMIN.(Ta=25℃)UBMAX.MIN.UCMAX.IV(mcd)UGMIN.MAX.MIN.UYMAX.MIN.URMAX.Condition4406008801,2001,760-IF = 20mAABCDEFGH6729602403364806729601,3444806729601,3441,920-1,3441,9202,6883,8401,3441,9202,6883,8405,376-9601,3441,9202,6883,8405,3761,9202,6883,8405,3767,680-2503505007001,0001,4005007001,0001,4002,000-2203004406008801,200󰋞Please contact our sales staff concerning rank designation of UYand UR.2004.12.27Page 5www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UB)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 6www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UB)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltagePower Dissipation vs. Ambient TemperatureAmbient Temperature : Ta(℃)Power Dissipation : Pd (mW)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 7www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UB)Dynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃Duty (%)IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 8www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UC)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 9www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UC)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltagePower Dissipation vs. Ambient TemperatureAmbient Temperature : Ta(℃)Power Dissipation : Pd (mW)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 10www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UC)Dynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃Duty (%)IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 11www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UG)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 12www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UG)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltagePower Dissipation vs. Ambient TemperatureAmbient Temperature : Ta(℃)Power Dissipation : Pd (mW)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 13www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UG)Dynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃Duty (%)IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 14www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeTechnical Data(UY)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 15www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UY)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltagePower Dissipation vs. Ambient TemperatureAmbient Temperature : Ta(℃)Power Dissipation : Pd (mW)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 16www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UY)Dynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃Duty (%)IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 17www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UR)Spectral DistributionRelative Intensity vs. WavelengthCondition : Ta = 25℃, IF= 20mA Spatial Distribution ExampleCondition : Ta = 25℃Relative IntensityWavelength[nm]Forward Voltage vs. Forward CurrentCondition : Ta = 25℃Forward Current vs. Relative IntensityCondition : Ta = 25℃Forward Current IF(mA)Forward Voltage VF(V)Relative IntensityForward Current IF(mA)2004.10.29Page 18www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UR)DeratingAmbient Temperature vs. Maximum Forward CurrentRepetition Frequency : f ≧50HzAmbient Temperature vs. Relative IntensityCondition : IF=20mAMaximum Forward Current : IFMAX. (mA)Ambient Temperature : Ta(℃)Relative IntensityAmbient Temperature : Ta(℃)Ambient Temperature vs. Forward VoltagePower Dissipation vs. Ambient TemperatureAmbient Temperature : Ta(℃)Power Dissipation : Pd (mW)Forward Voltage VF(V)Ambient Temperature : Ta(℃)2004.10.29Page 19www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTechnical Data(UR)Dynamic Drive RatingDuty cycle vs. Maximum Forward CurrentCondition : Ta = 25℃Maximum Forward Current : IF MAX. (mA)Pulse Width vs. Maximum Tolerable Peak CurrentCondition : Ta = 25℃Duty (%)IFpeak Max./IFDC MAX.Pulse Width : tw(μs)2004.10.29Page 20www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypePackage Dimensions(Unit: mm)2007.10.12Page 21www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeTTW (Through The Wave) solderingConditionsPre-heating Solder Bath Temp.Dipping Time100 ℃265℃5 s(MAX.)(MAX.)(MAX.)1) The dip soldering process shall be 2 times maximum.2) The product shall be cooled to room temp. before the second dipping process.※The detail is described to LED and Photodetector handling precautions of home page: \"Mounting through-hole Type Devices“and \"Soldering\Manual Soldering ConditionsIron tip temp.Soldering time and frequency400℃3 s2 times(MAX.)(MAX.)(MAX.)※The detail is described to LED and Photodetector handling precautions of home page:\"Mounting through-hole Type Devices“and \"Soldering\2006.3.31Page 22www.smdled.comU□38□4X Series Single Color φ3 Flush Mount Round Shape TypeReliability Testing ResultReliability TestingResultRoom Temp.Operating LifeResistance toSoldering HeatTemperature CyclingWet High Temp.Storage LifeHigh Temp.Storage LifeLow Temp.Storage LifeLead TensionVibration,Variable FrequencyApplicable StandardEIAJ ED-4701/100(101)EIAJ ED-4701/300(302)EIAJ ED-4701/100(105)EIAJ ED-4701/100(103)EIAJ ED-4701/200(201)EIAJ ED-4701/200(202)EIAJ ED-4701/400(401)EIAJ ED-4701/400(403)Testing ConditionsTa = 25℃, IF = Maxium Rated Current260±5℃, 1.6mm from package baseMinimum Rated Storage Temperature(30min)~Normal Temperature(15min)~Maximum Rated Storage Temperature(30min)~Normal Temperature(15min)Ta = 60±2℃, RH = 90±5%Ta = Maximum Rated Storage TemperatureTa = Minimum Rated Storage Temperature10N,1time (0.4 and Flat Package : 5N)98.1m/s(10G), 100 ~ 2KHz sweep for 20min.,XYZ each direction2 □Duration1,000 h10sFailure0/250/255 cycles0/251,000 h1,000 h1,000 h10s2 h0/250/250/250/100/10Failure CriteriaItemsLuminous IntensityForward VoltageReverse CurrentCosmetic AppearanceSymbolsIvVFIR-ConditionsIF Value of each productLuminous IntensityIF Value of each productForward VoltageVR = Maximum RatedReverse Voltage V-Failure criteriaTesting Min. Value < Spec. Min. Value x 0.5Testing Max. Value ≧ Spec. Max. Value x 1.2Testing Max. Value ≧ Spec. Max. Value x 2.5Occurrence of notable decoloration,deformation and cracking2007.8.31Page 23www.smdled.comU□38□4X SeriesSingle Color φ3 Flush Mount Round Shape TypeSpecial Notice to Customers Using the Products and Technical Information Shown in This Data Sheet1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor thegranting of any license.2) For the purpose of product improvement, the specifications, characteristics and technical data described inthe data sheets are subject to change without prior notice.Therefore it is recommended that the mostupdated specifications be used in your design.3) When using the products described in the data sheets, pleaseadhere to the maximum ratings for operatingvoltage, heat dissipation characteristics, and other precautions for use. We are not responsible for anydamage which may occur if these specifications are exceeded.4) The products that have been described to this catalog are manufactured so that they will be used for theelectrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment andnuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrongoperation might influence the life or the human body. Please consult us beforehand if you plan to use ourproduct for the usages of aircrafts, space borne application, transportation equipment, medical equipmentand nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AVmachine, home appliance and measuring instrument.5) In order to export the products or technologies described inthis data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,”it is necessary to first obtain an export permit from theJapanese government.6) No part of this data sheet may be reprinted or reproduced without prior written permission from StanleyElectric Co., Ltd.7) The most updated edition of this data sheet can be obtained from the address below:http://www.stanley-components.com2007.8.31Page 24

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